SZ-X3 AOI Inspection Machine with 5 Million Pixel Camera for Offline PCBA Testing
Key Attributes
Specifications
Computer AOI Inspection Machine
,CE AOI Inspection Machine
,Computer AOI Machine
The Computer White SZ-X3 AOI Inspection Machine with Color 5 Million Pixel Camera provides comprehensive visual inspection for PCBA boards across various applications including computer monitors, printers, LED display panels, tablet PCBA boards, and outdoor floodlight power control boards.
Compatible with Yamaha YSM20 and YS24 placement machines, this automated optical inspection system ensures high-quality manufacturing standards through advanced visual detection capabilities.
SMD (Surface Mounted Devices) refers to surface mount device components used in SMT technology, including CHIP, SOP, SOJ, PLCC, LCCC, QFP, BGA, CSP, FC, and MCM components. These devices enable high-density, reliable electronic assembly through automated pick-and-place equipment.
SMT (Surface Mount Technology) represents the current standard in electronics assembly, compressing traditional components into miniaturized SMD devices. This technology enables high-density, high-reliability, low-cost automated production with superior performance characteristics.
- Missing component
- Offset / Shift
- Tombstoning
- Reversed component
- Wrong component
- Component tilt
- Solder bridge / Short circuit
- Excess solder
- Insufficient solder
- Solder ball
- Damaged component
- Missing through-hole component
- Component offset / skewed
- Component reversed
- Bent pin / Crooked pin
- Pin not inserted
- Solder bridge / Short circuit
- Excess solder
- Insufficient solder
- Cold solder joint
- Solder ball / Solder splash
- Component damage
- Foreign matter
| Functional Specifications | Details |
|---|---|
| Tested circuit board | SMT reflow furnace pre-reflow furnace, post-circuit board inspection, wave soldering pre-soldering, wave soldering post-circuit board inspection |
| Detection method | Color extraction, statistical modeling, full-color image comparison, automatic setting of parameters according to different detection points |
| Camera | Full color smart digital camera |
| Resolution/Visual Range/Speed | Optional: 25μm/Pixel FOV: 40.70mm X30.90mm Detection speed < 270ms/FOV Standard: 20μm/Pixel FOV: 32.56mm×24.72mm Detection speed < 260ms/FOV Optional: 15μm/Pixel FOV: 24.42mm X18.54mm Detection speed < 240ms/FOV Optional: 10μm/Pixel FOV: 16.28mm X12.36mm Detection speed < 220ms/FOV |
| Light source | High brightness RRGB coaxial ring tower LED light source (color light) |
| Programming mode | Manual writing, automatic framing, CAD data import and automatic correspondence libraries |
| Special features | Multiple programs run simultaneously, support automatic recall program; 0-359° rotating parts (in 1° increments) |
| Minimal part testing | 10µm: 01005chip & 0.3pitch IC |
| SPC and process regulation | Record test data throughout the process with statistical analysis, output to Excel, Txt formats |
| Barcode system | Automatic camera recognition of 1D or 2D barcodes with multi-Mark function (including Bad Mark) |
| Server mode | Central server management for multiple AOI data sets |
| Operating system | Windows 7 Professional |
| Check result output | 22 inch LCD monitor |
| System Specifications | Details |
|---|---|
| Conveyor system | Automatic opening and retracting of bilateral fixtures with PCB bending deformation compensation |
| Conveyor height above ground | 850 to 920 mm |
| Conveyor flow / time | PCB moves in Y direction, In/out time: 2.5 seconds |
| X/Y platform driver | Screw motor driven, positioning accuracy < 20μm; PCB fixed, Camera moves in X direction |
| Power supply/air pressure | AC230V 50/60 Hz less than 1KVA / not required |
| Device weight | Approximately 390KG |
| Device form factor | 1070×900×1310mm (L×W×H) |
| Ambient temperature and humidity | 10~35°C 35~80% RH (non-condensing) |
| Equipment safety | Complies with CE safety standards |
