Second Hand JUKI KE-3020 SMT Mounting Machine Dual-head high-speed & high-precision universal SMT placement machine

Second Hand JUKI KE 2070 SMT Mounting Machine Full Automatic Six Head

JUKI full-automatic second-hand mounting machine KE-2070 six-head mounting machine

SMD LED or lens Pick And Place Machine Juki KE-2070 M substrate 330×250mm 

Stable Performance SMT Pick And Place Machine For LED Lighting Factory Used Juki

High Speed SMT Assembly Machine / Pick And Place Machine For Lighting Factory

High Accuracy SMD JUKI KE-2070 high speed Pick and Place Machine 0.155 sec/chip

Company Introduction

Shenzhen Sonch(Sanzhu) Technology Co., Ltd. is a professional high-tech enterprise focusing on SMT and THT automation equipment. Founded in 2015, the company is located in Fuyong, Bao’an District, Shenzhen, adjacent to the Shenzhen World Exhibition & Convention Center. We benefit from Shenzhen’s complete electronic manufacturing industrial chain, mature international logistics and superior foreign trade policies.

We adopt a unique business model of Manufacturing + Trade + Global Service. Our business covers independent equipment R&D and production, new/used imported equipment agency sales, and full-range supporting spare parts supply. We provide one-stop turnkey solutions for electronic manufacturing factories worldwide.

Our product lineup covers the entire electronic production process, including SMT inspection equipment, soldering equipment, core placement and insertion machines, automated peripheral equipment, as well as various spare parts and consumables. We support OEM customization, non-standard equipment customization and full production line configuration.

After years of industrial accumulation, Sonch(Sanzhu) Technology has built a professional technical R&D team, standardized production system and global foreign trade service team. With stable equipment performance, strict quality control and flexible customization capabilities, we have established long-term cooperative relationships with customers and authorized distributors across Southeast Asia, South Asia, the Middle East and other global regions.

Focusing on quality and service, we are committed to providing cost-effective SMT automation equipment and reliable technical support for global electronic manufacturers, and strive to become a trusted long-term partner in the global intelligent manufacturing industry.

JUKI KE-3020 Official English Technical Parameters

1. Basic Machine Information

•        Model: JUKI KE-3020 High Speed Flexible Universal Mounter (7th Generation KE Series)

•        Machine Type: Dual-head high-speed & high-precision universal SMT placement machine

•        Application: High-mix high-volume production covering ultra-small chips, standard components, fine-pitch IC, BGA, QFP and large irregular components, matching high-end flexible SMT production lines and compatible with FX-3 modular line configuration

2. Placement Performance

•        Maximum Chip Placement Speed: 20,900 CPH (laser recognition, optimal working condition)

•        Standard Production Speed (IPC9850): 17,000 CPH

•        Max IC Placement Speed (With MNVC): 9,470 CPH (multi-view vision camera)

•        Placement Accuracy (Laser Recognition): ±0.05mm

•        Placement Accuracy (Vision Recognition): ±0.03mm (Cpk≥1.0, high-resolution vision + MNVC module)

•        Placement Head Configuration: 1 × 6-nozzle high-speed laser head + 1 × 1-nozzle high-precision vision head

•        Component Recognition Mode: LNC60 laser alignment system + high-definition multi-view vision recognition system

3. Applicable Component Specifications

•        Laser Recognition Component Range: 0402 (01005 inch) ultra-small components ~ 33.5mm square components

•        Vision Recognition Component Range: 1.0×0.5mm ~ 74mm square components, max 50×150mm rectangular special-shaped components

•        Maximum Component Height: 6mm (standard); 12mm / 25mm (optional height extension module for XL version)

•        Total Component Types: Max 160 types (dual-lane electronic feeder); Max 80 types (standard single-lane 8mm feeder)

4. PCB Board Specification

•        Official PCB Size Versions

￮       M Size: 330 × 250mm

￮       L Size: 410 × 360mm

￮       L-Wide Size: 510 × 360mm (optional)

￮       XL Size: 560 × 510mm (ultra-large board optional version)

•        PCB Transport Direction: Left to Right / Right to Left (adjustable)

•        Transport Reference Side: Front side / Rear side (optional)

•        PCB Transport Height: 900mm / 950mm (optional)

•        Track Configuration: Single-track standard, KE-3020R dual-track optional version

5. Feeder Configuration

•        Max Feeder Station Quantity: 160 stations (dual-lane electronic feeder); 80 stations (single-lane feeder)

•        Compatible Feeder Types: Electronic dual-lane tape feeder, mechanical tape feeder, stick feeder, tray feeder (optional for IC/BGA bulk production)

6. Physical Dimension & Weight

•        Machine Dimension (L×W×H): 1400 × 1393 × 1440mm (M size configuration)

•        Net Weight: 1550kg (standard version)

7. Power & Air Supply

•        Rated Power: 3KVA

•        Power Supply: Three-phase AC 200V~415V, 50/60Hz

•        Air Pressure Requirement: 0.5±0.05MPa (dry, clean compressed air)

8. Core Features & Advantages

•        Dual-head collaborative design, combines high-speed chip mounting and high-precision fine-pitch component placement, realizing one-machine dual-purpose

•        Upgraded LNC60 laser system + high-definition MNVC multi-view vision system, greatly improved IC placement efficiency and stability

•        Supports dual-lane electronic feeders, maximum 160 component types, greatly enhances production flexibility for mixed batches

•        Native stable placement for 0402 ultra-small components, compatible with PoP stacking and special-shaped component processes (optional)

•        Multiple PCB size specifications adapt from small consumer boards to ultra-large industrial control and display boards

•        Perfectly compatible with FX-3 modular production lines, suitable for high-grade high-speed flexible SMT production scenarios

9. Notes

•        1. 20,900 CPH is the theoretical optimal speed; the actual IPC standard stable speed is 17,000 CPH, affected by component layout and feeding mode

•        2. 9,470 CPH high-speed IC placement depends on MNVC multi-view vision module

•        3. 12mm and 25mm ultra-high component placement requires official height extension accessories for XL version

•        4. KE-3020R is an official dual-track optional model, independently applicable for double-track production lines

•        5. M/L/L-Wide/XL versions only differ in PCB processing stroke, with consistent core placement speed and accuracy parameters