JUKI KE-3010 Pick And Place Equipment Native stable placement for 0402 ultra-small components, ideal for high-volume miniature component production

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Company Introduction

Shenzhen Sonch(Sanzhu) Technology Co., Ltd. is a professional high-tech enterprise focusing on SMT and THT automation equipment. Founded in 2015, the company is located in Fuyong, Bao’an District, Shenzhen, adjacent to the Shenzhen World Exhibition & Convention Center. We benefit from Shenzhen’s complete electronic manufacturing industrial chain, mature international logistics and superior foreign trade policies.

We adopt a unique business model of Manufacturing + Trade + Global Service. Our business covers independent equipment R&D and production, new/used imported equipment agency sales, and full-range supporting spare parts supply. We provide one-stop turnkey solutions for electronic manufacturing factories worldwide.

Our product lineup covers the entire electronic production process, including SMT inspection equipment, soldering equipment, core placement and insertion machines, automated peripheral equipment, as well as various spare parts and consumables. We support OEM customization, non-standard equipment customization and full production line configuration.

After years of industrial accumulation, Sonch(Sanzhu) Technology has built a professional technical R&D team, standardized production system and global foreign trade service team. With stable equipment performance, strict quality control and flexible customization capabilities, we have established long-term cooperative relationships with customers and authorized distributors across Southeast Asia, South Asia, the Middle East and other global regions.

Focusing on quality and service, we are committed to providing cost-effective SMT automation equipment and reliable technical support for global electronic manufacturers, and strive to become a trusted long-term partner in the global intelligent manufacturing industry.

JUKI KE-3010 Official English Technical Parameters

1. Basic Machine Information

•        Model: JUKI KE-3010 High Speed Chip Mounter (7th Generation KE Series)

•        Machine Type: High-efficiency laser-type high-speed SMT placement machine

•        Application: Mass high-volume production of ultra-small and standard chip components, widely used in consumer electronics, communication modules, LED products and high-yield standard SMT production lines

2. Placement Performance

•        Maximum Chip Placement Speed: 23,500 CPH (laser recognition, optimal working condition)

•        Standard Production Speed (IPC9850): 18,500 CPH

•        Max IC Placement Speed (With MNVC Option): 9,000 CPH

•        Placement Accuracy (Laser Recognition): ±0.05mm

•        Placement Accuracy (Vision Recognition): ±0.03mm (with MNVC multi-view vision module)

•        Placement Head Configuration: Single 6-nozzle high-speed laser placement head (LNC60 laser system)

•        Component Recognition Mode: High-precision laser alignment system + optional multi-view vision recognition system

3. Applicable Component Specifications

•        Standard Component Range: 0402 (01005 inch) ultra-small components ~ 33.5mm square components

•        Vision Component Range (MNVC Option): Medium-sized IC, QFP, BGA and irregular components

•        Maximum Component Height: 6mm (standard); 12mm / 25mm (optional height extension for XL version)

•        Total Component Types: Max 160 types (8mm dual-lane electronic tape feeder configuration)

4. PCB Board Specification

•        Official PCB Size Versions

￮       M Size: 330 × 250mm

￮       L Size: 410 × 360mm

￮       XL Size: 560 × 510mm (ultra-large board version)

•        PCB Transport Direction: Left to Right / Right to Left (adjustable)

•        Transport Reference Side: Front side / Rear side (optional)

•        PCB Transport Height: 900mm / 950mm (optional)

•        Track Configuration: Single-track standard, dual-track optional

5. Feeder Configuration

•        Max Feeder Station Quantity: 160 stations (8mm dual-lane electronic feeder standard)

•        Compatible Feeder Types: Electronic tape feeder, mechanical tape feeder, stick feeder, tray feeder (optional)

6. Physical Dimension & Weight

•        Machine Dimension (L×W×H): 1400 × 1393 × 1440mm (M size configuration)

•        Net Weight: 1550kg (standard version)

7. Power & Air Supply

•        Rated Power: 3KVA

•        Power Supply: Three-phase AC 200V~415V, 50/60Hz

•        Air Pressure Requirement: 0.5±0.05MPa (dry, clean compressed air)

8. Core Features & Advantages

•        Upgraded 6-nozzle laser head and LNC60 laser system, delivering higher stability and faster chip mounting speed

•        Supports dual-lane electronic feeders, greatly increasing component loading capacity and production flexibility

•        Native stable placement for 0402 ultra-small components, ideal for high-volume miniature component production

•        Optional MNVC module realizes high-speed IC mounting, balancing mass production efficiency and multi-component compatibility

•        Multiple PCB size options (M/L/XL) adapt to small, medium and ultra-large circuit board production needs

•        Optimized mechanical structure with lower failure rate and excellent long-term mass production stability

9. Notes

•        1. 23,500 CPH is the theoretical optimal speed; actual production speed is subject to component type, PCB layout and feeder configuration

•        2. 9,000 CPH high-speed IC placement performance requires optional MNVC multi-view vision system

•        3. 12mm and 25mm high component placement is only available for XL version with official height extension accessories

•        4. M/L/XL versions only differ in PCB stroke and structural size, with identical core placement accuracy and speed parameters

•        5. Dual-track structure is an optional configuration, not an independent model version