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Used KE-2060 SMT Placement Machine JUKI FX-2 High Speed Automatic LED SMT Machine

Key Attributes

Brand Name: JUKI
Model Number: KE-2060
Place of Origin: JAPAN
Certification: QC
Minimum Order Quantity: 1
Price: Discuss price
Supply Ability: 50pcs/month
Delivery Time: Discuss
Payment Terms: T/T,Western Union
Standard Packaging: 1.Wooden case and vacuum package 2.Or as your requirements

Specifications

Highlight Features

Used automatic SMT placement machine

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JUKI FX-2 SMT placement machine

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high speed LED smt machine

Product Name:
Used JUKI Smt Chip Mounter
Model:
KE-2060
PCB Sizes:
M Size: 330 × 250mm (standard)
Applicable Components:
0402 (01005 Inch) Components (with Dedicated Optional Module)
Machine Dimension:
(L×W×H) 1400 × 1393 × 1440mm (M Size Configuration)
Net Weight:
1410kg
Product Description

Equipment name: used JUKI FX-2, refurbished JUKI FX-2 placement machine, used JUKI FX-2 smt placement machine


Company Introduction

Shenzhen Sonch(Sanzhu) Technology Co., Ltd. is a professional high-tech enterprise focusing on SMT and THT automation equipment. Founded in 2015, the company is located in Fuyong, Bao’an District, Shenzhen, adjacent to the Shenzhen World Exhibition & Convention Center. We benefit from Shenzhen’s complete electronic manufacturing industrial chain, mature international logistics and superior foreign trade policies.

We adopt a unique business model of Manufacturing + Trade + Global Service. Our business covers independent equipment R&D and production, new/used imported equipment agency sales, and full-range supporting spare parts supply. We provide one-stop turnkey solutions for electronic manufacturing factories worldwide.

Our product lineup covers the entire electronic production process, including SMT inspection equipment, soldering equipment, core placement and insertion machines, automated peripheral equipment, as well as various spare parts and consumables. We support OEM customization, non-standard equipment customization and full production line configuration.

After years of industrial accumulation, Sonch(Sanzhu) Technology has built a professional technical R&D team, standardized production system and global foreign trade service team. With stable equipment performance, strict quality control and flexible customization capabilities, we have established long-term cooperative relationships with customers and authorized distributors across Southeast Asia, South Asia, the Middle East and other global regions.

Focusing on quality and service, we are committed to providing cost-effective SMT automation equipment and reliable technical support for global electronic manufacturers, and strive to become a trusted long-term partner in the global intelligent manufacturing industry.

JUKI KE-2060 Official English Technical Parameters

1. Basic Machine Information

        Model: JUKI KE-2060 High Precision Universal Mounter

        Machine Type: Dual-head high-speed & high-precision general-purpose SMT placement machine

        Application: Mixed mass production of chip components, IC, BGA, QFP and irregular components, widely used in consumer electronics, industrial control and automotive electronic products

2. Placement Performance

        Chip Component Placement Speed: 12,500 CPH (laser recognition, optimal working condition)

        Standard IC Placement Speed: 1,850 CPH (vision recognition)

        Max IC Placement Speed (With MNVC Option): 3,400 CPH (multi-view vision camera)

        Placement Accuracy (Laser Recognition): ±0.05mm

        Placement Accuracy (Vision Recognition): ±0.03mm

        Placement Head Configuration: 1 × 4-nozzle laser head + 1 × 1-nozzle high-resolution vision head

        Component Recognition Mode: Laser alignment system + high-precision visual inspection system

3. Applicable Component Specifications

        Laser Recognition Component Range: 0603 (0201 inch) ~ 33.5mm square components

        Vision Recognition Component Range: 1.0×0.5mm ~ 74mm square components / max 50×150mm rectangular components

        Optional Ultra-small Component Support: 0402 (01005 inch) components (with dedicated optional module)

        Maximum Component Height: 6mm

        Total Component Types: Max 80 types (standard 8mm tape feeder configuration)

4. PCB Board Specification

        Supported PCB Sizes

       M Size: 330 × 250mm (standard)

       L Size: 410 × 360mm

       L-Wide Size: 510 × 360mm

       E Size: 510 × 460mm (extra-large board optional)

        PCB Transport Direction: Left to Right / Right to Left (adjustable)

        Transport Reference Side: Front side / Rear side (optional)

        PCB Transport Height: 900mm / 950mm (optional)

5. Feeder Configuration

        Max Feeder Station Quantity: 80 stations (8mm tape feeder standard)

        Compatible Feeder Types: Tape feeder, stick feeder, tray feeder (optional for IC/BGA components)

6. Physical Dimension & Weight

        Machine Dimension (L×W×H): 1400 × 1393 × 1440mm (M size configuration)

        Net Weight: 1410kg

7. Power & Air Supply

        Rated Power: 3KVA

        Power Supply: Three-phase AC 200V~415V, 50/60Hz

        Air Pressure Requirement: 0.5±0.05MPa (dry, clean compressed air)

8. Core Features & Advantages

        Dual-head collaborative design, balancing high speed and high precision placement

        Independent high-resolution vision head, stable placement for fine-pitch IC, BGA and QFP components

        Optional MNVC multi-view camera module greatly improves IC placement efficiency

        Wide component compatibility, supports ultra-small chips to large-size special-shaped components

        High operational stability, low maintenance cost, suitable for mixed SMT production lines

9. Notes

        1. All CPH data refer to theoretical optimal speed; actual production speed is affected by component type, PCB layout and feeding scheme

        2. 0402 (01005 inch) ultra-small component placement function requires official optional accessories and calibration

        3. MNVC multi-view vision system is an optional accessory, which is necessary for high-efficiency mass production of IC components

        4. Different PCB size configurations do not change the core placement accuracy and basic performance parameters