JUKI KE-2070 High Speed Module 23300 Chips/Hour Flexible Chip Mounter Used FX-1R SMT Machine

SMT mounter JUKI FX-1R high speed module mounter used SMT electronics

used JUKI FX-1R Placement Machine SMT automatic production line equipment,

JUKI placement machine FX-1/1R used JUKI chip mounter smt placement equipment

Company Introduction

Shenzhen Sonch(Sanzhu) Technology Co., Ltd. is a professional high-tech enterprise focusing on SMT and THT automation equipment. Founded in 2015, the company is located in Fuyong, Bao’an District, Shenzhen, adjacent to the Shenzhen World Exhibition & Convention Center. We benefit from Shenzhen’s complete electronic manufacturing industrial chain, mature international logistics and superior foreign trade policies.

We adopt a unique business model of Manufacturing + Trade + Global Service. Our business covers independent equipment R&D and production, new/used imported equipment agency sales, and full-range supporting spare parts supply. We provide one-stop turnkey solutions for electronic manufacturing factories worldwide.

Our product lineup covers the entire electronic production process, including SMT inspection equipment, soldering equipment, core placement and insertion machines, automated peripheral equipment, as well as various spare parts and consumables. We support OEM customization, non-standard equipment customization and full production line configuration.

After years of industrial accumulation, Sonch(Sanzhu) Technology has built a professional technical R&D team, standardized production system and global foreign trade service team. With stable equipment performance, strict quality control and flexible customization capabilities, we have established long-term cooperative relationships with customers and authorized distributors across Southeast Asia, South Asia, the Middle East and other global regions.

Focusing on quality and service, we are committed to providing cost-effective SMT automation equipment and reliable technical support for global electronic manufacturers, and strive to become a trusted long-term partner in the global intelligent manufacturing industry.

JUKI KE-2070 Official English Technical Parameters

1. Basic Machine Information

•        Model: JUKI KE-2070 High Speed Flexible Chip Mounter

•        Machine Type: High-speed laser placement machine dedicated for micro chip components

•        Application: Mass high-speed production of ultra-small chip components, consumer electronics, LED modules, communication and compact PCB products

2. Placement Performance

•        Maximum Chip Placement Speed: 23,300 CPH (optimal working condition, 0.155 sec/chip)

•        Standard Production Speed (IPC9850): 18,300 CPH

•        IC Placement Speed (With MNVC Option): 4,600 CPH

•        Placement Accuracy (Laser Recognition): ±0.05mm

•        Placement Accuracy (Vision Recognition): ±0.04mm

•        Placement Head Configuration: Single 6-nozzle high-speed laser placement head

•        Component Recognition Mode: High-speed laser alignment system + optional multi-view vision system

3. Applicable Component Specifications

•        Standard Component Range: 0402 (01005 inch) ultra-small components ~ 33.5mm square components

•        Vision Recognition Component Range (Optional MNVC): Medium-sized IC, QFP and special-shaped components

•        Maximum Component Height: 6mm (standard); 12mm (optional)

•        Total Component Types: Max 80 types (standard 8mm tape feeder layout)

4. PCB Board Specification

•        Supported PCB Sizes

￮       M Size: 330 × 250mm (standard)

￮       L Size: 410 × 360mm

￮       E Size: 510 × 460mm (extra-large board optional)

•        PCB Transport Direction: Left to Right / Right to Left (adjustable)

•        Transport Reference Side: Front side / Rear side (optional)

•        PCB Transport Height: 900mm / 950mm (optional)

5. Feeder Configuration

•        Max Feeder Station Quantity: 80 stations (8mm tape feeder standard)

•        Compatible Feeder Types: Tape feeder, stick feeder; tray feeder optional for IC components

6. Physical Dimension & Weight

•        Machine Dimension (L×W×H): 1400 × 1393 × 1440mm (M size configuration)

•        Net Weight: 1530kg

7. Power & Air Supply

•        Rated Power: 3KVA

•        Power Supply: Three-phase AC 200V~415V, 50/60Hz

•        Air Pressure Requirement: 0.5±0.05MPa (dry, clean compressed air)

8. Core Features & Advantages

•        Industry-leading 6-nozzle laser head design, specially optimized for high-volume micro component mounting

•        Native support for 0402 (01005) ultra-small chips without basic modification

•        Optional MNVC multi-view camera module upgrades IC placement capability, balancing speed and versatility

•        High-speed and stable laser recognition system, excellent consistency for long-time mass production

•        Cost-effective high-speed chip mounter, widely used in high-volume standard SMT production lines

9. Notes

•        1. 23,300 CPH is the theoretical optimal speed; the IPC standard stable production speed is 18,300 CPH, affected by component arrangement and feeding mode

•        2. IC high-efficiency placement function depends on optional MNVC multi-view vision system

•        3. 12mm high component placement requires official optional height extension module

•        4. Different PCB size configurations only change stroke range, not affect core placement speed and accuracy