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Company Introduction

Shenzhen Sonch(Sanzhu) Technology Co., Ltd. is a professional high-tech enterprise focusing on SMT and THT automation equipment. Founded in 2015, the company is located in Fuyong, Bao’an District, Shenzhen, adjacent to the Shenzhen World Exhibition & Convention Center. We benefit from Shenzhen’s complete electronic manufacturing industrial chain, mature international logistics and superior foreign trade policies.

We adopt a unique business model of Manufacturing + Trade + Global Service. Our business covers independent equipment R&D and production, new/used imported equipment agency sales, and full-range supporting spare parts supply. We provide one-stop turnkey solutions for electronic manufacturing factories worldwide.

Our product lineup covers the entire electronic production process, including SMT inspection equipment, soldering equipment, core placement and insertion machines, automated peripheral equipment, as well as various spare parts and consumables. We support OEM customization, non-standard equipment customization and full production line configuration.

After years of industrial accumulation, Sonch(Sanzhu) Technology has built a professional technical R&D team, standardized production system and global foreign trade service team. With stable equipment performance, strict quality control and flexible customization capabilities, we have established long-term cooperative relationships with customers and authorized distributors across Southeast Asia, South Asia, the Middle East and other global regions.

Focusing on quality and service, we are committed to providing cost-effective SMT automation equipment and reliable technical support for global electronic manufacturers, and strive to become a trusted long-term partner in the global intelligent manufacturing industry.

Yamaha YSM10 Compact High-Speed Modular Mounter Full English Specifications

1. Basic Information

•        Model: YSM10

•        Type: Compact High-Speed Single-Beam Modular SMT Placement Machine (Entry-level Z:LEX Platform Model)

•        Core Structure: High-rigidity single beam & single head structure, ultra-compact body design, single-lane high-stability conveyor platform

•        Feature Positioning: World-class efficiency for 1-beam 1-head class, balances high speed and universal component compatibility, cost-effective mass production solution

2. Mounting Performance

1.      Max Mounting Speed: 46,000 CPH (under Yamaha optimal test conditions, standard HM head configuration)

2.      Mounting Accuracy: ±0.035mm (3σ, Cpk≥1.0); Ultra-precision calibration ±0.025mm (optimal evaluation condition)

3.      Mount Head Configuration
       

￮       High-Speed Multi (HM) 10-Nozzle Head: Standard universal head, no frequent head replacement required

4.      Performance Advantage: Upgraded wide-scan camera, expands high-speed mounting range up to 12mm components, supports ball device recognition for special packaging parts

3. PCB Specifications

•        Applicable PCB Size: Min L50×W50mm / Max L510×W460mm

•        PCB Thickness: 0.4mm ~ 3.0mm

•        PCB Transport: Standard single-lane servo conveyor, stable high-speed continuous transmission, supports flexible small-batch and mass production

4. Component Compatibility

•        Component Range: 03015 ultra-micro chip / 0201 chip ~ Max W55×L100mm large components

•        Max Component Height: ≤15mm (Optional multi-camera required for components over 6.5mm)

•        Max Feeder Capacity: 120 types (converted to standard 8mm tape feeder)

•        Supported Feeder & Module Types: Tape feeder, stick feeder, optional sATS15 automatic tray feeder module

5. Power & Air Requirements

•        Power Supply: Three-phase AC 200/208/220/240/380/400/416V, voltage tolerance ±10%, 50/60Hz

•        Working Air Pressure: ≥0.45MPa clean and dry compressed air

6. Overall Dimension & Weight

•        Main Machine Outer Size (exclude protruding parts): L1,254 × W1,440 × H1,445mm

•        Net Weight of Main Unit: Approx. 1,270kg

7. Standard Configuration & Core Highlights

•        Ultra-compact single-beam structure, small footprint and high space utilization, suitable for flexible factory layout

•        Universal 10-nozzle HM head, compatible with ultra-fine chips to large-size components without head replacement

•        New-generation wide-scan visual recognition system, excellent adaptability for various standard and special components

•        Supports multiple feeding modes including tape, stick and optional tray feeding, flexible for mixed component production

•        Intelligent feeder diagnosis and automatic nozzle cleaning system, stable operation and low maintenance cost

•        Z:LEX platform compatible, reserved intelligent factory expansion interface for subsequent intelligent line upgrading